SMIC claims 0.11-micron CMOS image sensor process

SMIC (Semiconductor Manufacturing International Corp) today announced that it has developed a 0.11-micron CIS (CMOS image sensor) process technology.

The foundry claimed that with the new production process SMIC-manufactured CIS devices exhibit improved resolution, low noise, and enhanced image contrast for high performance CMOS imager applications. SMIC did not detail the improvements.

"Using optimized process conditions, we've successfully reduced dark noise, enabling performance in low light environments," Paul Ouyang, SMIC's VP of marketing and sales, said in a statement. "These features deliver to our customers a high performance product at a reasonable cost, which allows them to enhance their competitiveness and gain leading positions in an ever-growing CIS market."

SMIC offers complete CIS foundry service in China, where the 0.11-micron CIS capability follows on the company's existing 0.18-micron and 0.15-micron CIS technologies.

SMIC said the 0.11-micron CIS technology is available with both aluminum and copper backend metallization, and claimed it is ideal for a wide range of applications, including camera phones, computer cameras, and industrial and security monitoring devices.

SMIC added that it has begun pilot production of the technology, which can be manufactured on 200-mm and 300-mm wafers.