IRVINE, Calif., November 6, 2008 – HID Global, the trusted leader in providing solutions for the delivery of secure identity, today announced that it has established an agreement with INSIDE Contactless, a leading provider of advanced open-standard contactless chip technologies, to manufacture contactless prelaminates for INSIDE Contactless based upon the MicroPass intelligent payment platform.
"The expansion of our partnership directly reflects the fundamental changes that are taking place in the contactless market," said Denis HĂ©bert, president and CEO of HID Global. "As issuers seek to provide their customers with convenient, yet more secure platforms for cashless payment cards, it was only natural that both INSIDE and HID should partner to fulfill that existing need."
By extending their partnership, INSIDE Contactless will be able to provide card manufacturers with access to the MicroPass contactless payment platform coupled with contactless antenna technology in prelaminate packages from HID Global, further enabling card issuers to deliver an exceptional cardholder experience within this emerging market.
Experiencing more than 40 percent growth annually, the North American contactless payment market has witnessed exponential growth driven by consumer demand for faster, easier and more convenient methods of payment. Additionally, card issuers have adopted contactless technology in an effort to add greater value for the consumer and increase revenues by replacing cash at the point of sale.
HID Global’s solutions for contactless payment, eGovernment and e-Documents, as well as its full portfolio of converged products for cashless payment, transit, access control, identification and logical access will be on display in the HID Global stand (#3H002) at CARTES & IDentification 2008 in Paris, France, from November 4 – 6. CARTES attendees are invited to visit the booth to encounter a “World of New Possibilities†enabled by HID technology.
