Teledyne FLIR OEM Expands Boson Line With SX8 Thermal Imaging Module
Teledyne FLIR OEM’s Boson SX8 thermal camera module featuring 8-micron pixel technology and SXGA resolution designed for compact high-performance infrared imaging applications.
Teledyne FLIR OEM, a business unit of Teledyne Technologies Incorporated, has announced the release of the ITAR-free Boson® SX8, a new NDAA-compliant, volume production uncooled longwave infrared thermal camera module.
The Boson SX8 is the first of its kind to combine an 8-micron pixel pitch with SXGA resolution of 1280 × 1024 in a compact uncooled LWIR thermal camera module. According to the company, the 8-micron pixel enables higher thermal performance and delivers four times the resolution of current high-volume uncooled VGA 640 × 512 thermal camera modules while maintaining a similarly sized package.
Designed for applications where size, weight and power are constrained, the Boson SX8 family targets defense and industrial use cases. These include uncrewed aircraft systems, counter-UAS, perimeter security, handheld devices, seekers, visual augmentation and intelligence, surveillance and reconnaissance systems. The modules are intended to deliver thermal imaging performance previously associated with larger and more power-hungry cooled midwave infrared systems.
“By reducing pixel area by 55% compared to the standard 12-micron LWIR pixel format, Boson SX8 represents a transformational moment for thermal imaging,” said Paul Clayton, President of Teledyne FLIR OEM. He added that the platform pairs an 8-micron pixel architecture with SXGA resolution to improve situational awareness and extend effective range without compromising size, weight, power or supply chain confidence.
The product line includes multiple fixed-lens configurations as well as the Boson SX8-CZ 15–75, which integrates a factory-calibrated 5x continuous zoom lens system. The 15–75 mm continuous zoom lens is engineered as a single integrated system with focus-through-zoom capability, thermal gradient compensation, factory alignment and a single-source warranty, designed to reduce integration risk and speed deployment.
Teledyne FLIR OEM states the Boson SX8 and SX8-CZ 15–75 are manufactured at high volume in the United States and designed for production-scale deployment. The modules also integrate with the company’s Prism™ intelligent embedded software products to support OEM development through full-rate manufacturing.
The Boson SX8 family will be demonstrated at Eurosatory 2026 at the Teledyne FLIR OEM booth in Paris, where the company plans to showcase advances in high-definition SWaP-optimized thermal imaging.